Production Capabilities

Max. board size (Double-sided): 475 x 533 mm ( 18" x 21" )
Max. board size (Multi-layer): 406 x 254 mm (16" x 10")
Board thickness : 0.5 - 3.0 mm
Min. track between tracks : 100 microns
Min. via/hole dia. : 300 microns

Range of Products

Single-sided
Double-sided
Multilayer (up to 16 Layers)
Hybrid Circuits
Emersion Gold
Substrate Material : FR-4 & Others

Engineering Systems

Schematic Capture & PCB Design using software tools
High Resolution Photo-plotting
File formats supported
RS 274 X; RS 274 D; DXF; DPF; IPC-D-356

Surface Finishing

Gold Plating
Hot Air Leveling

Quality Assurance

IPC Standards
Automatic Optical inspection (AOI)
Flying Probe Tester (FPT)