Range of Products

Rigid / Flex / MLB
Single-sided PCB Double-sided PCB
Multilayer (up to 16 Layers) PCB
Blind Vias Supported
Aluminum Based Copper clad
Polyimide Hybrid Circuits

Max Panel Size
Max. Panel size (Double-sided): 508 x 560 mm (20” x 22”)
Max. Panel size (Multi-layer): 457 mm x 304 mm (18" x 12")
Board thickness : 0.2 – 3.0 mm
Min gap between tracks : 0.1 mm

Engineering Systems
Schematic Capture & PCB Design(PCB Reverse
Engineering) using software tools. High
Resolution Photo-plotting File formats supported RS 274 X; DXF; DPF; IPC-D-356

Final Thickness
Min Panel thickness : 0.5 mm
Max Panel Thickness: 3.2 mm

Material
FR4
FR2
CEM1

Surface Finishing
HASL\Leaded Solder
Bare Copper
Carbon Ink

Solder mask Type/ Colors
LPI
Green Color

Finished Cu Weight / Trace / Space

Outer Layers
Min. trace gap : 100 microns
Min. trace width: 100 microns
Min. via/hole dia. : 300 microns
Min legend line : 0.15 mm

Gold Fingers
Edge Connectors

CNC Function
CNC Routing
Grooving
45 Degree Gold Finger Bevel
Controlled Z Axis Rout

Quality Assurance
Inspect at IPC Class III 600G standards
Automatic Optical inspection (AOI)
Flying Probe Tester (FPT)
Micro section (Coupon Testing)
Bare board Jig Testing

Inner Layers
0.5 0z. Cu. (Min 0.006" Trace/Space)
1 oz. Cu. (Min 0.006" Trace/Space)

Inner Layer Clearances
0.2 mm

Other Services
Min Plated Slots 0.5 mm
Min Non-Plated Slots 0.5 mm
Controlled Dielectric
Gold Fingers up to 18" Long